German Mindshare.de First Quarter sales data for 2019 is in. AMD is still outselling Intel 2-1 in individual chip sales, verging on a 5-1 ratio for some of the more poplar AMD models.
The Big Box finished unit sales still tend to be the more expensive gaming rigs, and there sales still tilt more towards the Intel boxes. Sales of large expensive gaming rigs are light at the moment, with the main flow of gaming sales going towards the Xbox/PlayStation sort of device.
The gaming stations are almost 100% AMD based now. This has been consistent for over a year now.
New Finished PC Units announced are predominately AMD based and tend towards the middle to lower total power range. This is also about the fact that AMD's middle to lower power level is as strong as the very best Intel ever was a couple of years ago. Smart shoppers know this and buy accordingly.
New Unit Sales is different from the Total Installed Units comparisons. Watch this point when folks throw numbers around a lot, it is VERY misleading when they get them mixed up. Total Installed Units total data is old enough to say that Win 7 is still the dominant OS installed on the machines comprising this data ......
Some Stuff to remember as we head into the big AMD ZEN 3000 announcements for 7nm production .......
IT IS ALL BASED ON THIS STUFF .....
The new AMD tech is this server tech, with some of the EPYC chiplets actually being the exact same as the RYZEN chiplets in some cases. The AMD Ryzen 3000 lineup is based on the new Zen 2 core architecture which is made possible with TSMC’s bleeding edge 7nm process node. AMD has reaffirmed that their Zen 2 based Ryzen 3000 series processors for the AM4 desktop platform will be available in mid of 2019. We are now hearing multiple reports of a possible launch in early July and that might be it as far as the launch day is concerned for the new desktop processors.
AMD has made significant changes to their CPU architecture which help deliver twice the throughput of their first generation Zen architecture. The major points include an entirely redesigned execution pipeline, major floating point advances with doubled the floating point to 256-bit and double bandwidth for load/store units. One of the key upgrades for Zen 2 is the doubling of the core density which means we are now looking at 2x the core count for each core complex (CCX).
Improved Execution Pipeline
Doubled Floating Point (256-bit) and Load/Store (Doubled Bandwidth)
Doubled Core Density
Half the Energy Per Operation
Improved Branch Prediction
Better Instruction Pre-Fetching
Re-Optimized Instruction Cache
Larger Op Cache
Increased Dispatch / Retire Bandwidth
Maintaining High Throughput for All ModesSo, Lisa Su actually sandbagged very strongly at her last big show presentation because Intel had totally failed in their 10nm execution and all the advanced items AMD had prepped for use against Intel 10nm were not needed at all, any whatsoever in the last six months.
So Lisa Su totally sandbagged on all that advanced 10nm Intel beating stuff, very very strongly sandbagging all the new features she could have shown in her previous show presentations.
She did this SPECIFICALLY to allow more time for more of AMD's old 12nm inventory to sell through at full price, and indeed AMD is even now hosting a MASSIVE Retail Discount Push to try to move all the rest of the old AMD 12nm inventory all the way out of the way before the new AMD 7nm stuff arrives in a few months.
AMD knows that the new 7nm stuff will sell much much better than the old 12nm stuff did to the point if AMD doesn't help their vendors to move out all their old 12nm inventory then their vendor base might take some damage when the new 7nm stuff makes the old 12nm stuff relatively undesirable and "obsolete".
The vendors have got to move the 12nm products before it becomes un-moveable.
Since some of the most recent 7nm AMD advances are all server sized pipeline widths, greatly increased pipeline through puts and various other basic structural changes, these changes have got to come out now anyway. Ditto for the 7nm chiplet structure being like the server/rackspace structure and all the advancements based on that. If you think some of the consumer RYZEN data handling, floating point and branch prediction is going to be more like mainframe/server/rackspace type stuff, you are correct in that particular thought.
Look to see Intel Consumer processors drop way behind the leader at this point in time, almost shamefully far behind. Intel consumer can't compete on a wide range of features any more.
Intel is gonna be playing catch up from now on --- extending out for around 5 years to a decade or thereabouts.===================================================
Understand what comes after 7nm and why it will arrive so very quickly.5nm is what it is called. It it can run on some of the most current ASML equipment that was purchased for 7nm production, so all players can take advantage of the 14-20% speed and efficiency improvements. You can also get twice as many wafers off your silicon wafer when compared to 10nm, so that is another good reason to use 5nm.
The final reason is one Intel cannot touch or understand ..... unless they want to start stacking their 14nm chips up into towering infernos again.
5nm direct burn EUV can burn stacked layers directly into a solid thick silicone wafer when carefully calibrated and focused and controlled.
Like ..... well ..... nothing we have ever seen done before. Current 7nm EUV can lay down 4 relatively crude stacked layers into a simple thick memory wafer --- generally used for simple stuff like memory chips, but the first generation 7nm EUV machines had to be customized out the wazoo to do that stacked laydown trick at all. But both TSMC and Samsung worked it all out and got it to yield enough good chips to make it work well.
So, the stacked laydown tricks have been refined twice now and are now built right into the new 5nm ASML production machines as a basic function. Standard 5nm ASML EUV direct burn machines can lay down stacked layers 14 layers deep right into the same silicon wafer and that is with the standard 5nm production equipment.Apple is going 5nm ASAP (A-14 production) because they can do just about the entire device inside the layers of the CPU itself, including a goodly bit of memory.
This saves a lot of money and a lot of post burn assembly processing time. The chips run a lot faster and the energy they use to run is a lot less.
So, watch the Apple A-14 chipset when it comes out for radical new capabilities due to 5nm 14 layer direct burn EUV.