https://www.google.com/search?q=too+many+cores&oq=too+many+cores&aqs=chrome.....Intel supporters out in computer land are beginning to whine about how that they cannot keep paying for all these extra cores --- too much money, too much heat, too much power consumption. They are talking about Intel products in all these comments, because Intel is all they will ever talk about.Considering that these commentators really are Intel's paid talking heads (they are given new equipment for free by Intel), what we are really hearing is that Intel can't afford to go any further up into the core count wars without losing out even worse on yield/price/heat/power.
AMD at 105 watts can pull together a 16 core Ryzen 9 that costs less than half what the proposed Intel 18 core units cost and the AMD unit beats the Intel 18 core unit on any front you wish to name including COST, power used, heat, data throughput, gaming and overclockability.

Let's hold back for a bit and intentionally not talk about Epyc or Xeon rackspace level units from either side, let's agree to stop at High Performance Computing level which is the upper end of what Consumers do. So lets talk the "shortly due for update" Threadripper level, the very top end of the AMD consumer spectrum.
Intel is in a bind there at the top end of Consumer because they have in essence just re-labeled some of their older huge Xeon rackspace units from a few years ago to be their top end HPC units.
These ex-Xeon HPC Intel units could not compete against the old Threadripper units from AMD for the last two years running, not for energy use, cores counts or computing throughput. On raw power, yes Intel could reach up high enough into their Xeon line up to pull down something to match AMD Threadripper on computing raw power, but at a 2-3x price bump and a 2x power usage penalty.
Lisa Su intends to fix this inbalance this time around ....... She can easily build whatever she needs out of chiplets to do the full complete hit job on Intel Consumer HPC products very very completely, then she can declare that as the start point of the pumped up Epyc line that is going to get refreshed next year.
Remember, the exaggerated bogus 10nm Intel claims were considered to be real back when the 7nm AMD chiplets were designed, and the AMD 7nm chiplets were designed to beat Intel's completely bogus claims for Intel's 10nm products, products which never came about (and still haven't).So now Intel is in a real quandary, AMD is now using the exact SAME throughput improved, more energy efficient compute chiplets in all of their newest products. Chiplets which test yield at over 75% yield rates at full speed, test all good on all 8 cores, making up very power efficient 7nm chiplets that are very easy to make by the wafer full on current TSMC processes. AMD then slices the wafers up into chiplets and automatically sorts them for grading/binning once the chiplet wafers arrive at AMD.
And the throughput grading results are simply getting a lot better over time as the lot after lot after lot of a steady production pace tends to make the TSMC production process more closely tuned and the chiplets tend to simply perform better and better and better.
So, AMD keeps on raising their chipset performance numbers accordingly.
By pre-testing all the chiplets and putting like-speed chiplets into the same warehouse storage bins AMD has put together a streamlined production system to build an exactly controlled range of known good CPUs at a very minimal manufacturing & scrap cost.
This leads Lisa Su to be able to do the "Twice the throughput at HALF the cost" mantra thing
and to actually mean it.
Intel has a very basic problem here. The much larger, more complex the "built as one piece" Intel products becomes, the lower the resulting production yield numbers will be --- so by increasing their core counts any further Intel is actually cutting their own throats monetarily --- and so now Intel is orchestrating their paid yak yak tech press taking heads to all tell us that
Intel wants to quit the core count race.
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Guess what Intel, Lisa says she is just now getting started good. Keeping to 25% less current draw (that's 75% of the power that the current Intel products require) Lisa Su is again giving you
half again more to twice as many cores and twice or more on the throughput, and she is really actually doing it at half the retail cost of the old Intel products.
Intel is now beginning to panic. AMD just announced the Threadripper Refresh is coming ---- going up from 32 cores up to 64 of these same Gen 3 Ryzen / Epyc chiplet cores in a configuration that smells similar to a smaller version of full sized Epyc. This is the proposed upper end of Consumer for AMD, and yet this is going past what you get in the lower part of the current Epyc server line (Epyc which is likely to get stronger yet again during their next refresh in 2020). AMD's Ryzen and Threadripper competition is just about totally going to lap Intel's existing Xeon rackspace line of processors, in other words. AMD's Epyc line will simply kill Intel completely.
AMD is refreshing and improving on a 2x per year frequency, rolling through their product lines one at a time in an organised fashion. Intel has no timely response to this as Intel's natural improvement pace has never been better than a 1-2 year tick-tock improvement cycle.
Remember, Intel is already 3-4 real lithography generations behind AMD at this point in time, and Intel is falling further and further behind as AMD keeps rolling out the lithography improvements.AMD is beginning to talk about 4-5nm as their next chiplet lithography level as Samsung is taking over the next AMD lithography improvement step, doing the 4-5nm lithography bump now not 2 years from now as TSMC was originally talking about doing.
TSMC is responding by setting themselves up to leapfrog all the way down to 2-3nm in 2021-22 as their next big competitive lithography move. This leapfrog action on lithography is a repeated pattern between Samsung and TSMC and it has occurred multiple times in the past decades.
Intel is beginning to see the handwriting up on the wall.Intel is losing 20-25% of their real compute power to mitigations for their 5 current predictive security illnesses, Intel has had to shut off their hyperthreading completely due to the same security illnesses, Intel is on the wrong end of the production yield curve on having to make more and more cores into more and more complex chipsets and Intel is currently suffering total line competitive price/cost losses to AMD on all fronts.
AND NOW their Intel fanboys and Intel press supporters are beginning to actually talk out loud about these issues ........
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Samsung and AMD and ARM collaboration side effects. ARM is British based and ARM is used to being at the forefront of their cell phone based technology. They have had customers "jump ship" for better graphics before, it caused them to regroup on graphics and equal and better what folks had jumped ship to go get.
AMD has VERY GOOD graphics and ARM will have to raise their graphics bar a LOT to equal AMD graphics. Samsung is very good at tuning ASML lithography and at chipset packaging and Samsung does co-development with folks like Samsung, IBM, AMD, Global Foundries, etc. very well.
TSMC just likes to copy the advancements made by folks like Samsung and IBM.
AMD and Samsung and IBM and Global all have existing full design licenses with ARM, so they all have access to all the guts and they all have the ability to tweek the guts. ARM technology is already inside the AMD chiplets and I look for AMD chiplet tech to get better after being shrunk to mate up with 3-4nm Samsung lithography. I also look for AMD to start supplying a right killer small laptop / Chromebook chipset out of this collaboration.
ARM will improve their processor designs to meet or beat what Samsung/AMD puts together --- it will take a year or so but it will wind up happening the same way it has done multiple times before when Samsung/Qualcomm took the tech lead for a few years and then gave the lead up to TSMC who had spent that time in leapfrog lithography activities. ARM tech catches up and takes a leap each time this happens, incorporating the advancements.
IBM is pretty much pure research at this point in time, but remember IBM tech advancements are co-licensed by Samsung, AMD and some of the others. IBM quantum processors and AI processor tech keep the overall advancement pace bumped up to snuff pretty much.
Shunted off to the side now by legal issues and/or a general inability to keep up with the leapfrog pace of change -- Qualcomm and Intel.
COMPLETELY Sidelined by US gov. sanctions -- HuaweiTrying to make a come back into some major league play and to take up some of Huawei's lost positions -- Mediatek
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Question for you to think about ...... AMD is going down to 4-5nm lithography soon but the existing chiplet size and connection pattern will remain pretty much the same as it is all automated at that size and the traces are all known and programmed into the automated assembly equipment already. Core count for the existing 7nm chiplets was 8 cores per chiplet, with room left to squeeze in mebbe 2 more cores or some extra memory if AMD had really really felt it needed to go do that badly enough to change their chiplet layouts in between lithography levels.
So, If AMD uses up all the free standard chiplet layout space very efficiently with tightly packed 4-5nm cores and with adding in some more on chip memory (remember this next level of production equipment can lay down 14 layers of stuff into the same solid piece of silicon (3x more layers than before) so how many cores and how much extra memory will that wind up being inside each new generation chiplet? 12 to 16 cores per chiplet is my wild arsed guess ...... and remember these same sized chiplets will drop right into the existing overall automated assembly chiplet layout carrying that same proportionate increase in core counts, and in memory, and in throughput, and in higher efficiency & lower current draw.
Poor Intel.
Your future sure does look bleak, boys.
AMD is improving strongly 2x per year, far far faster than you can even try to respond.